With certified production facilities according to ISO 13485-2016 standard, AEMtec provides next level technologies for complex, custom (opto-) electronic applications to customer's specification. The company has a broad portfolio of high-end chip-level technologies, including Wafer Back-End Services, Chip on Board, Flip Chip, 3D Integration and Opto-Packaging for Medical Devices. An extensive suite of development services as well as the availability of inhouse test equipment and series production capabilities round off the range of services.

AEMtec provides a complete service portfolio to ensure ideal conditions. Individual requirements can be serviced and implemented in the shortest periods. Customers gain from the various assembly technologies offered from a single source.

With our US Tech Center located in Boston we provide responsive and knowledgeable input to our

US customers for their challenging and innovative projects. Our Tech Center is equipped with a cutting-edge laboratory, enabling high-precision development.

Learn more: AEMtec USA Inc.